Bhubaneswar, March 14: With its robust policy and pro-industry approach, the Odisha government has attracted a total investment of Rs 14,586.80 crore in the semiconductor sector.
According to information given by Industries Minister Sampad Charan Swain in the State Assembly today, six semiconductor projects are in pipeline in Khurda districts.
The State has signed an MoU with Heterogeneous Integration Packaging Solutions Pvt Ltd for establishment of a semiconductor unit in Khurda at a cost of Rs 1926 crore. This project will provide employment for 1072 persons, Swain said.
The Industries Minister has also informed that five other projects with a cumulative investment of Rs 12,660.80 crore are under pipeline/ proposal stage.
The projects are—RIR Power Electronics Ltd (Rs 618.62 crore), SicSem Pvt Ltd (Rs 2946.50 Cr), Kaynees Semicon Pvt Ltd (Rs 2825.70 Cr), Sancode Semi Pvt Ltd (Rs 1649.98 Cr) and ASP Semicon Private Limited (Rs 4620 Cr), he stated.
Chief Minister Mohan Charan Majhi had laid the foundation stone for development of the first silicon carbide manufacturing facility to be set up by RIR Power Electronics at EMC Park, Infovalley here in 2024.
Last year, the State had approved an incentive for the RIR Power Electronics Limited for the Silicon Carbide semiconductor manufacturing project in Bhubaneswar.
This project marks the establishment of India’s first Silicon Carbide semiconductor fabrication facility, positioning Odisha as a pioneer in advanced electronics manufacturing.
By focusing on Silicon Carbide technology, the facility will enable the production of energy-efficient and high-performance components, reducing dependence on imports.
The project is expected to create around 750 direct and indirect jobs, contributing significantly to local employment and skill development.
At present, the State has the Odisha Semiconductor Manufacturing and Fabless Policy, which envisions developing an end-to-end semiconductor ecosystem in the State.
The policy aspires to contribute to the national semiconductor ecosystem development objectives and aims to transform Odisha into a leading center of semiconductor design and manufacturing, a startup hub for semiconductor R&D and design companies, and the primary repository of the semiconductor design talent in the country.
In August last year, the Central Government had approved two more semiconductor projects for Odisha under India Semiconductor Mission (ISM). These two approved proposals are from SiCSem and 3D Glass Solutions Inc.
SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneswar. This will be the 1st commercial compound fab in the country. The project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will have applications in Missiles, Defence equipment, Electric Vehicles (EVs), Railway, Fast Chargers, Data Centre racks, Consumer Appliances, and Solar Power Inverters.
Similarly, 3D Glass Solutions Inc. (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley here. This unit will bring world’s most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to the semiconductor industry.
The facility will have a large variety of advanced technologies including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) modules.
Planned capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum.
The proposed products will have significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics etc.
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