Industry Odisha Bureau Jun 3: With a reported investment of about $3.3 billion, and the proposed investment that reportedly involves collaboration between Intel, the State Government, and the US-based 3D Glass Solutions (3DGS), Odisha is bracing up for entering into a critical layer of the global high-tech manufacturing ecosystem and also be in the chip supply chain.
As per reports, “The project would not be a conventional semiconductor fabrication plant (fab), but it would focus on advanced glass-core substrates and chip packaging equally critical parts for the semiconductor ecosystem.”
Notably, “Experts deem ‘glass substrates’ to be one of the next major advances in semiconductor packaging, particularly for AI, data-center, defense, and high-performance computing chips.”
Because, glass substrates offer: “better electrical performance and signal integrity”, “higher density inter-connections”, “improved thermal stability”, and last but not the least, “ability to support much larger and more powerful AI processors”.
As per the analysts, “Such a project and initiative would not only position Odisha as more than a mining and metals economy, but also make the state a semiconductor and electronics hub in eastern India.”
Besides, the analysts also opine that, “Odisha is positioning itself at the frontier of next-generation semiconductor packaging technology – a field expected to underpin future AI, defense, and high-performance computing systems.”
It is also claimed that, such projects create: “direct engineering as well as semiconductor processing jobs, materials science as well as research and development roles, supplier ecosystems, and academic-industry collaborations”.
